Capabilities:

Pick and Place

SMT 0402, 0603, 0805, 1206
QFP-44 to QFP-256
BGA-119 to BGA-256
All Fine Pitch
All SOIC
From Board Size 1/8” to 12”x20”
Consignment and Turnkey Assembly

Equipment:

1 MPS5000 Aqueous Inline Cleaner
2 Zevatech PM-570L
1 Zevatech PM-560
1 MyData 12
1 Heller 1088HAC Reflow
1 Econopak 229 Electrovert with Wave Dynamics.
Wave Soldering Machine
1 Q Corportation Lead-O-Matic II
1 ETR-403 Ogden Temperature Controll Oven
2 Hakko 153 Resistor Former
1 OLAMEF TP/6 Resistor Bendor
1 SD901 IC Lead Former
1 Hepco 1500-1 Capacitor Trimmer
1 Hepco 1700-2 Capacitor Trimmer
1 Hakko FR-801 Rework Station
5 Hakko 936 Soldering Station
5 Edsyn 951SX Soldering Station
6 LSM-180 Magnifier Lamp
3 Nikon Stereoscope Magnifer